BIWIN Black Opal X570 GEN5 (1TB)
Offer: offline price 28432 ₹ for PC Build only. Note : Discounted Special offer price are valid for only one unit of SSD.
About this item : Biwin X570 PCIe Gen5x4 NVMe 2.0 SSD The Biwin Black Opal X570 PCIe Gen5x4 NVMe 2.0 SSD delivers impressive sequential read/write speeds up to 14500 MB/s and 11000 MB/s. Built with premium 3D TLC NAND, it handles demanding tasks with ease, whether for gaming, video editing, or AI model training. With advanced thermal management, the X570 ensures a stable performance even under heavy workloads. With up to 2400 TBW and a 5-year limited warranty, the Biwin X570 offers optimized endurance with proven reliability. Unlock the Cutting-Edge Speeds of Gen5 Taking full advantage of PCIe Gen5x4 and NVMe 2.0, the Biwin X570 achieves ultra-fast read speeds up to 14500 MB/s—approaching the maximum limit of PCIe 5.0. Equipped with premium 3D TLC NAND, it ensures peak performance even under intense workloads. From loading massive AAA games, transferring 4K/8K footage, or accelerating AI model training, the Biwin X570 turns heavy workloads into smooth operations. *It is recommended for use with AMD Ryzen 9000 series processors and X870 motherboards. Install on the PCIe 5.0 M.2 interface for optimal performance. *Tested by BIWIN’s labs. Actual performance may vary due to devices and environment. *Compared to PCIe 4.0 SSDs with 7000 MB/s read speed and PCIe 3.0 SSDs with 3500 MB/s read speed. Data Access Acceleration with HMB & SLC Cache The Biwin X570 uses Host Memory Buffer (HMB) and intelligent SLC cache to speed up response times. HMB allows the SSD to use the host´s DRAM to improve I/O performance, while dynamic SLC cache intelligently reallocates cache blocks, optimizing SSD efficiency and extending its lifespan. This caching architecture enables faster, more stable, and improved responsive operations within an optimized DRAM-less design. Effective Heat Management for Sustained Performance Efficient thermal management ensures consistent performance under sustained workloads. Biwin X570 integrates a temperature control algorithm and thermal graphene pad to improve heat dissipation efficiency. Supported by Thermal Throttling and Power Management, the drive maintains optimal operating conditions during prolonged high-speed data transfer, multi-tasking, and gaming scenarios, ensuring reliable performance during even the most intensive usage cycles. *It is recommended to use SSD cooling solutions for optimal performance.
BIWIN Black Opal X570 GEN5 (1TB)
Biwin X570 PCIe Gen5x4 NVMe 2.0 SSD
The Biwin Black Opal X570 PCIe Gen5x4 NVMe 2.0 SSD delivers impressive sequential read/write speeds up to 14500 MB/s and 11000 MB/s. Built with premium 3D TLC NAND, it handles demanding tasks with ease, whether for gaming, video editing, or AI model training. With advanced thermal management, the X570 ensures a stable performance even under heavy workloads. With up to 2400 TBW and a 5-year limited warranty, the Biwin X570 offers optimized endurance with proven reliability.
Unlock the Cutting-Edge Speeds of Gen5
Taking full advantage of PCIe Gen5x4 and NVMe 2.0, the Biwin X570 achieves ultra-fast read speeds up to 14500 MB/s—approaching the maximum limit of PCIe 5.0. Equipped with premium 3D TLC NAND, it ensures peak performance even under intense workloads. From loading massive AAA games, transferring 4K/8K footage, or accelerating AI model training, the Biwin X570 turns heavy workloads into smooth operations.
Data Access Acceleration with HMB & SLC Cache
The Biwin X570 uses Host Memory Buffer (HMB) and intelligent SLC cache to speed up response times. HMB allows the SSD to use the host´s DRAM to improve I/O performance, while dynamic SLC cache intelligently reallocates cache blocks, optimizing SSD efficiency and extending its lifespan. This caching architecture enables faster, more stable, and improved responsive operations within an optimized DRAM-less design.
Effective Heat Management for Sustained Performance
Efficient thermal management ensures consistent performance under sustained workloads. Biwin X570 integrates a temperature control algorithm and thermal graphene pad to improve heat dissipation efficiency. Supported by Thermal Throttling and Power Management, the drive maintains optimal operating conditions during prolonged high-speed data transfer, multi-tasking, and gaming scenarios, ensuring reliable performance during even the most intensive usage cycles.
Single-Sided Design, Compatible with Many Devices
The Biwin X570 features a single-sided, DRAM-less design supported by advanced packaging technology that enables a slimmer profile, lower power consumption and more efficient heat dissipation. Compatible with PCIe 4.0 and PCIe 3.0*, the drive fits seamlessly into a wide range of devices and platforms. It’s ideal for flexible upgrades in today´s systems.
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